HP ML350 G4 - do the XEON processors need heat sink compound?

Posted by Golfman on Server Fault See other posts from Server Fault or by Golfman
Published on 2010-04-16T07:49:22Z Indexed on 2010/04/16 7:53 UTC
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I pulled the heat sinks off a HP ML350 G4 and there appears to be no heat sink compound between the processor and the heat sink surfaces. It looks like the point at which they make contact is actually metal on the processor which is a good conductor anyway. Perhaps the compound is only needed when the processor has a ceramic top instead of a metal one?

Anyone know?

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